As we all know, the quality of heat dissipation technology will directly affect the performance of the mobile phone. The new product of ROG gaming mobile phone is destined to continue the efficient heat dissipation performance of the Qualcomm version of ROG 6. Predictably, materials that can improve heat dissipation such as large-area graphene and vacuum chamber temperature equalizing plate will be used, and the central CPU architecture design with excellent heat dissipation effect will also be retained. The design keeps heat source away from handheld parts, ensures good feel in long battles, and helps players show high score operations. At the same time, the motherboard and RF board of aerospace grade cooling material boron nitride is also likely to be retained, which will further improve the heat dissipation effect, maintain efficient operation, can effectively reduce frame lag and other problems. In addition, according to the Revelations, ROG6 Tianji Supreme version will also adopt a new cooling scheme, with a significantly updated cooling system, bringing far more efficient cooling performance than previous products.
< /p> In addition to excellent cooling design, ROG game mobile phone new products will also be equipped with 6.78 inch ultra-high brush rigid straight screen, 6000mAh double cell and 65W fast charge, etc., new products will be officially unveiled on September 19, we may wish to wait and see.
