/PRZWT/At the critical stage of the manufacturing industry moving towards high-quality development, digital transformation is becoming an important path for enterprises to build core competitiveness. As a leading enterprise in the field of new materials, Bowei Alloy, with its smart factory as the foundation, has established an AI-driven material research and development system. Against the backdrop of a surge in computing power, it has achieved a leap from "material bottleneck" to "AI breakthrough", providing a typical sample of new quality productivity for the industry. In 2025, two of the company's intelligent factories, namely the high-performance alloy materials intelligent factory of Bowei Alloy and the special performance alloy sheet and strip intelligent factory of Bowei New Materials, were successfully selected as "Advanced Intelligent Factories of Zhejiang Province (First Batch)", further consolidating their exemplary position in the field of intelligent manufacturing.
At present, global artificial intelligence computing power is experiencing explosive growth. According to authoritative reports, China's intelligent computing power scale is predicted to grow rapidly from 414.1 EFLOPS in 2023 to 1,037.3 EFLOPS in 2025, and the connector transmission rate is also advancing from 112Gbps to 224Gbps or even higher. Against this backdrop, connectors, as key components in data centers and communication equipment, are evolving towards miniaturization, high density, and high reliability. Traditional copper alloy materials used in connectors are gradually facing performance bottlenecks in terms of strength, heat resistance, and signal integrity, becoming a key factor restricting the development of high-speed interconnection technology.
The copper alloy material for the upgraded connector needs to strike a balance between high electrical conductivity and high strength, while also having excellent resistance to thermal stress relaxation, good formability, low surface roughness and the ability to design irregular shapes, in order to meet the strict requirements of high-speed, high-temperature and highly reliable transmission in the AI era. This multi-objective optimization challenge forms an "impossible triangle" in the materials field, forcing the industry to make a leap from "experience-driven" to "data-driven".
Facing this challenge, Bowei Alloy has relied on its independently developed "AI Digital Vertical Field Application Large Model" to build a full-chain simulation system covering "composition design - process optimization - application research". This model integrates over 16 million material data points and, through precise calculation and intelligent recommendation, achieves rapid optimization of alloy composition and process parameters.
Supported by this system, Bowei Alloy has successfully launched a variety of high-performance copper alloy materials for AI high-speed interconnection. Take boway 70318 as an example. This material maintains medium conductivity while having a strength of over 940MPa. It can still maintain over 85% stress after 1000 hours in a 150℃ high-temperature environment. It has excellent bending and forming performance, making it an ideal choice for miniaturized and high-density connectors such as CPU sockets and high-speed I/O connectors. Another ultra-high strength and environmentally friendly copper alloy, boway 19920, has a yield strength exceeding 1400MPa and maintains excellent performance at a high temperature of 200℃, solving the signal loss problem of AI high-computing server connectors in scenarios of thinning and high-temperature resistance.
The digital transformation of Bowei Alloy is not only reflected in the level of technological research and development, but also runs through the global manufacturing and supply chain system. The company has established fourteen specialized manufacturing bases in China, Germany, Canada, Vietnam and other places, building an efficient and collaborative global supply chain network. In 2025, its parent company, Bowei Group, was successively listed on the "Top 500 Private Manufacturing Enterprises in China 2025", "Top 500 Private Enterprises in R&D Investment 2025" and "Top 500 Private Enterprises in Invention Patents 2025" lists released by the All-China Federation of Industry and Commerce, fully demonstrating its comprehensive strength in R&D innovation and high-end manufacturing.
Looking ahead, as computing power infrastructure continues to upgrade and high-speed interconnection technology keeps evolving, Bowei Alloy will continue to enhance the computing power of AI large models, deepen the integration of material design and application scenarios, and empower the innovative development of next-generation information technology with more precise, efficient and green material solutions. Contribute material wisdom and solid strength to China's transformation from a "manufacturing giant" to a "manufacturing power".
